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Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing

What happened
Based on Intel Newsroom · Jun 18, 2026

Intel appoints Seok-Hee Lee as executive vice president of Intel Foundry to lead advanced packaging and system integration, reporting to CEO Lip-Bu Tan, while Naga Chandrasekaran continues overseeing front-end development.

Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
Intel Newsroom — Intel
Key points
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SANTA CLARA, Calif., June 18, 2026 — Intel Corporation today details the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan.
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In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers.
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As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership.
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This reflects the growing importance and complexity of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems.
Key numbers
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Intel also announced the retirement of executive vice president Navid Shahriari after a 37-year career at the company.

Intel has named Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. Lee will oversee advanced packaging, system integration, and back-end technology development and manufacturing, aligning with Intel’s strategy to enhance system-level innovation for customers. The appointment reflects the growing significance of packaging in improving performance, power efficiency, and heterogeneous integration across AI systems. Intel emphasizes that packaging is becoming a critical capability for next-generation computing systems.

Lip-Bu Tan, Intel CEO, highlighted Lee’s expertise in leading complex technology and manufacturing organizations. Tan stated that Lee’s leadership will help strengthen Intel’s system integration capabilities, enabling tighter coupling of logic, memory, networking, and other components. The role includes scaling advanced packaging technologies such as EMIB-T and HBI for high-volume production. Lee previously served as president and CEO of SK On and SK hynix, bringing extensive experience in semiconductor manufacturing and engineering leadership.

Naga Chandrasekaran will continue as executive vice president of Intel Foundry, reporting to Lip-Bu Tan, focusing on front-end technology development and manufacturing. Chandrasekaran will also oversee Intel 18A, Intel 14A, and future technologies, along with design enablement and customer-facing functions. The reorganization aims to accelerate the ramp of Intel’s advanced process technologies while reinforcing execution and predictability for customers and partners.

Intel also announced the retirement of executive vice president Navid Shahriari after a 37-year career at the company. The company will release its earnings report after market close on July 23, with CEO Lip-Bu Tan outlining progress in rebuilding execution, strengthening core businesses, and advancing responsible growth in the AI era.

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