Intel at AI Infra Summit 2026
Intel will present its AI infrastructure strategy at AI Infra Summit 2026, emphasizing scalable solutions across edge, cloud, and physical AI environments through panel discussions and demonstrations.
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Intel Newsroom coverage
Every ClipRaptor briefing sourced from Intel Newsroom, with a direct link to the original publisher page.
Intel Outlines Architectures for Agentic AI at Hot Chips 2026
Intel unveils three architectures for Agentic AI at Hot Chips 2026: Diamond Rapids for enterprise-scale orchestration, Crescent Island for efficient inference, and Wildcat Lake for edge computing. The designs leverage...
Six in 10 Leaders Bet Big on Robots. Only Four in 10 Are Ready.
A 2026 Intel study finds 60% of leaders plan robot fleets within five years, yet only 40% have strategies to manage them, revealing a readiness gap in scaling automation.
Intel Announces Upsize and Pricing of $20 Billion Common Stock Offering
Intel upsized its common stock offering to $20 billion at $95 per share, raising $19.7 billion net for general corporate use, including capital expenditures and working capital.
Intel Gamer Days 2026 Kicking Off with AAA Gaming Bundle & Partnerships
Intel’s Gamer Days 2026 campaign launches August 10 with a retail bundle offering free digital copies of two upcoming games with qualifying Intel hardware purchases.
Intel Announces Proposed $15 Billion Common Stock Offering
Intel plans a $15 billion common stock offering to fund growth in AI compute and maintain its investment-grade rating, with proceeds allocated to general corporate purposes.
Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth
Intel appoints Dean Jarnac as executive vice president and chief sales officer to lead global sales and strengthen customer relationships across its product portfolio starting September 2026.
Creating Pathways to Semiconductor Careers: Intel Launches SEPP
Intel has launched the Semiconductor Education Pathways Program (SEPP) to develop a skilled semiconductor workforce through education partnerships in Arizona, New Mexico, Ohio, and Oregon.
Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors
Intel expands U.S. advanced packaging capabilities at its Rio Rancho, New Mexico facility, scaling multi-chip systems to 8x the industry standard and over 12x by 2028 to meet AI workload demands.
Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave
Intel Foundry completed the RAMP-C program, advancing domestic semiconductor manufacturing for U.S. defense and commercial use. The initiative, led by the Department of War, established a pathway for secure, high-volume...
Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
Intel and Lens Technology will jointly develop glass substrate-based semiconductor packaging to enhance performance, power efficiency, and interconnect density for AI and data center applications.
Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience
Intel and Fortinet will jointly develop the Fortinet Security Processor 6 (SP6) using Intel’s semiconductor design and manufacturing capabilities to enhance cybersecurity performance and supply chain resilience.
Intel-Powered Medical Exoskeleton Helps Patients Get Back on Their Feet
Intel and Onyx Healthcare unveiled an AI-powered exoskeleton, FREE Walk, designed to enhance lower-limb rehabilitation for patients with mobility impairments by leveraging Intel Core Ultra CPUs and OpenVINO software.
Intel and Google Cloud Announce Collaboration to Accelerate Intel’s AI-Enabled Enterprise Transformation
Intel and Google Cloud expand their partnership to deploy Google’s Gemini Enterprise AI across Intel’s global operations, aiming to automate workflows in engineering, supply chain, and corporate functions while...
Intel Invests €5 Billion to Expand Manufacturing in Europe
Intel commits €5 billion ($5.7 billion) to expand its Leixlip, Ireland manufacturing campus, enhancing production of Intel Xeon 6 and next-generation processors to meet rising AI and high-performance computing demand.
Intel to Report Second-Quarter 2026 Financial Results
Intel will release its second-quarter 2026 financial results on July 23, 2026, followed by an earnings call to discuss performance and strategic updates.
Three ways Intel and MSI co-engineered the world’s first Arc G3 handheld
Intel and MSI unveiled the world’s first handheld gaming device powered by the Intel Arc G3 Extreme processor at Computex in Taipei, Taiwan. The MSI Claw 8 EX AI+ is now available in a limited-edition "void purple"...
America 250: At a Pivotal Moment for the Nation, Intel is Advancing U.S. Innovation, AI, and Manufacturing
Intel advances U.S. innovation and AI leadership through domestic semiconductor manufacturing, workforce programs, and AI education initiatives as part of America250 celebrations.
Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
Intel appoints Seok-Hee Lee as executive vice president of Intel Foundry to lead advanced packaging and system integration, reporting to CEO Lip-Bu Tan, while Naga Chandrasekaran continues overseeing front-end...
CEO Letter: 2025-26 Intel Corporate Responsibility Report
Intel outlines progress in its 2025–26 Corporate Responsibility Report, emphasizing engineering focus, financial discipline, and global semiconductor innovation amid AI expansion.
Intel Advances Responsible Business Practices and AI-Driven Growth in 2025–2026 Corporate Responsibility Report
Intel published its 2025–2026 Corporate Responsibility Report, detailing progress in AI governance, energy efficiency, and community investments totaling $916 million over 37 years.
Intel Foundry Details Process Milestones and Future Innovation at VLSI Symposium
Intel Foundry reports progress on its Intel 18A-P process node at the 2026 VLSI Symposium, highlighting risk production milestones and long-term innovation commitments for AI computing advancements.
New Smart City Pilot Network to Bridge Digital Divide for 50 U.S. Cities
Intel and Tradewinds Networks launched Bellflower Connect, a solar-powered municipal network in California, to provide affordable internet access to 50 U.S. cities by 2027, addressing digital exclusion and high telecom...
Postcard from Computex 2026: New Intel® Core™ Series 3 laptops for Everyday Creation and All-day Productivity
Intel unveiled six new Intel® Core™ Series 3 laptops at Computex 2026, emphasizing long battery life, AI features, and advanced connectivity for mainstream users, with over 70 designs expected from major PC...