Nikon Launches DSP-110 Digital Lithography System with 1.5 µm Resolution
Nikon will launch the DSP-110 digital lithography system in April 2027, offering 1.5 µm resolution and 40% higher throughput than its predecessor for semiconductor advanced packaging.
Nikon Corporation announced the upcoming release of the DSP-110 digital lithography system, scheduled for April 2027. The system is designed for semiconductor advanced packaging applications, targeting high-density wiring requirements for large interposers and multilayer FC-BGA substrates. The DSP-110 eliminates the need for photomasks while maintaining high resolution and productivity, addressing growing industry demands.
The DSP-110 achieves a resolution of 1.5 µm (Line and Space) and a throughput of 72 panels per hour, representing approximately 40% higher throughput than the DSP-100. This improvement was enabled by redesigning the optical system of the DSP-100, leveraging Nikon’s in-house optical design and manufacturing capabilities. The system supports various substrate sizes, including square formats up to 730 × 920 mm and wafers up to 300 mm.
The DSP-110 maintains high overlay accuracy of ≤±0.3 µm while expanding the focus margin compared to the DSP-100. This enhancement ensures stable patterning across diverse substrate conditions, improving yield and mass production stability. The system’s flexibility allows for future upgrades to 1.0 µm resolution by replacing its optical system.
Nikon developed the DSP-110 as a successor to the DSP-100, reflecting its commitment to advancing digital lithography for semiconductor packaging. The company will continue monitoring technology trends to meet evolving customer needs, including resolution and substrate type requirements.