Selected for NEDO's "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of Manufac
Nikon will develop a 0.5 µm resolution digital lithography system for advanced semiconductor packaging under a NEDO program to support post-5G infrastructure.
Nikon Corporation has been selected by the New Energy and Industrial Technology Development Organization (NEDO) for a research project aimed at developing core technologies for post-5G information and communication systems. The company’s proposal focuses on creating a high-resolution digital lithography system capable of achieving 0.5 µm line-and-space resolution for advanced semiconductor packaging. This initiative aligns with NEDO’s goal of strengthening the manufacturing foundations for next-generation communication technologies while promoting decarbonization.
The project addresses the growing demand for high-performance semiconductor devices driven by the expansion of post-5G networks and artificial intelligence applications. Nikon’s development targets the back-end semiconductor manufacturing process, specifically panel-level packaging, where high-resolution exposure technology is critical for forming dense redistribution layers on large substrates.
Under its Medium-Term Management Plan, Nikon has prioritized digital lithography systems as a key focus area. The company has previously developed systems with resolutions of 1.0 µm and 1.5 µm, achieving overlay accuracy of ±0.3 µm or better. This new project will advance these capabilities by targeting a resolution of 0.5 µm and overlay accuracy of ±0.15 µm.
Through this NEDO-selected project, Nikon aims to reduce energy consumption by 50% compared to conventional systems while improving productivity. The development of this high-resolution digital lithography system is expected to support the production of advanced semiconductor devices essential for post-5G infrastructure.