OFICIAL Nikon News

Selected for NEDO's "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems / Development of Manufac

What happened
Based on Nikon News · Oct 20, 2026

Nikon will develop a 0.5 µm resolution digital lithography system for advanced semiconductor packaging under a NEDO program to support post-5G infrastructure.

Key points
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Nikon selected by NEDO for post-5G semiconductor lithography project with 0.5 µm resolution target
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Project aims to reduce energy use by 50% while improving overlay accuracy to ±0.15 µm
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Nikon previously achieved 1.0 µm and 1.5 µm resolution systems under its Medium-Term Management Plan
Key numbers
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Nikon Corporation has been selected by the New Energy and Industrial Technology Development Organization (NEDO) for a research project aimed at developing core technologies for post-5G information and communication systems.
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The project addresses the growing demand for high-performance semiconductor devices driven by the expansion of post-5G networks and artificial intelligence applications.
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Through this NEDO-selected project, Nikon aims to reduce energy consumption by 50% compared to conventional systems while improving productivity.

Nikon Corporation has been selected by the New Energy and Industrial Technology Development Organization (NEDO) for a research project aimed at developing core technologies for post-5G information and communication systems. The company’s proposal focuses on creating a high-resolution digital lithography system capable of achieving 0.5 µm line-and-space resolution for advanced semiconductor packaging. This initiative aligns with NEDO’s goal of strengthening the manufacturing foundations for next-generation communication technologies while promoting decarbonization.

The project addresses the growing demand for high-performance semiconductor devices driven by the expansion of post-5G networks and artificial intelligence applications. Nikon’s development targets the back-end semiconductor manufacturing process, specifically panel-level packaging, where high-resolution exposure technology is critical for forming dense redistribution layers on large substrates.

Under its Medium-Term Management Plan, Nikon has prioritized digital lithography systems as a key focus area. The company has previously developed systems with resolutions of 1.0 µm and 1.5 µm, achieving overlay accuracy of ±0.3 µm or better. This new project will advance these capabilities by targeting a resolution of 0.5 µm and overlay accuracy of ±0.15 µm.

Through this NEDO-selected project, Nikon aims to reduce energy consumption by 50% compared to conventional systems while improving productivity. The development of this high-resolution digital lithography system is expected to support the production of advanced semiconductor devices essential for post-5G infrastructure.

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